Model | Structure Type | Features | Application Cases |
M（Manual） | • Combined XY translation and θ rotation • Manual adjustment via micrometer head or precision lead screw • No motor or controller required | • Intuitive operation and fine adjustment • Simple structure with high stability • Suitable for scenarios with low alignment frequency and clear precision requirements | • Microscope sample alignment: Fine-tune sample position under metallographic and stereo microscopes • Optical component assembly and adjustment: Initial alignment of lenses, optical filters and mirrors • Teaching experiment platform: Fundamental optics and micro-nano experimental teaching in universities |
E（Electric） | • Electric XY translation + manual/electric θ rotation • Motor-driven, programmable control supported | • Supports remote control and automatic positioning • High alignment efficiency and excellent repeatability • Easy to integrate into automatic systems | • Wafer testing & inspection platform: Rapid positioning of wafers for probe testing and optical inspection • Automatic optical alignment system: Mass assembly adjustment and consistency testing of optical modules • On-line inspection equipment: Equipped with industrial cameras to realize automatic visual alignment |
EP（High-precision Electric Alignment Stage） | • High-resolution electric XY translation + precision rotary axis • Closed-loop feedback structure optional | • High repetitive positioning accuracy • Small backlash error, suitable for sub-micron alignment • Applicable to high-end scientific research and precision manufacturing | • 2D material transfer alignment: heterojunction and stacking angle control • Pre-alignment for micro-nano lithography: fine positioning before exposure • Nano-device fabrication experiments: alignment and processing of precision structures |
V（High-precision Electric Alignment Platform） | • XYθ alignment structure with vacuum suction carrier surface • Compatible with electric or manual driving integration | • Stable sample fixation, anti-slip performance excellent • Ideal for thin slices and wafer samples • Enhance safety and consistency during alignment process | • Wafer-level experiment and processing: Alignment of 4–6 inch wafers • Thin film sample transfer: Positioning of flexible substrates and thin film materials • Optical inspection system: Reduce errors caused by sample displacement |
C（Custom Extended Alignment Platform） | • Basic XYθ structure • Expandable with Z-axis, tilt axis and special fixtures | • Highly customized • Customizable design for specific process requirements• Easy to combine with other precision stages | • Multi-axis precision adjustment platform: Assembly and calibration of complex optical systems • Special experimental devices for scientific research: Integration of non-standard experimental structures • Mini automatic process equipment: Multi-station alignment and transfer |
